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http://pesn.com/Radio/Free_Energy_Now/shows/2007/01/06/9700221_Eneco_thermal_electric/
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PureEnergySystems.com > Radio > Free Energy Now > Jan. 6, 2006

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Top 100
ENECO Engineering Low-Heat-to-Electricity Conversion for Market

The science is done, what remains is to engineer for production, with applications such as waste-heat and concentrated solar energy harnessing.

Download recording
(58:29 min; 13.7 Mb; mp3)

click for enlargement

ENECO die (wafer) test set-up
Sample of ~1 square millimeter is placed between heat source on bottom and ambient temperature on the top.  Test method was certified by NIST. (Ref.)

 


Pure Energy Systems News
Copyright © 2007

SALT LAKE CITY, UT, USA -- On Saturday, Jan. 6, 2006, Sterling Allan conducted a live interview with Howard L. (Lew) Brown, CEO of ENECO, which has a thermal-electric technology for converting heat into electricity via a solid state wafer.

The technology is presently rated in the top ten of the New Energy Congress' (NEC) Top 100 Energy Technologies listing.  (Ref.)  Articles about it have been published in at least two peer-review journals.  ENECO'S scientific testing apparatus has been certified by the National Institute of Standards and Technology (NIST) in Boulder, Colorado, whose independent (and non-published, since NIST cannot endorse commercial ventures) experimental conclusions report an efficiency of 38% of the Carnot limits. (Ref.)

Though the wafers begin generating electricity with a gradient (Δ T) as low as 1°C at room temperature, the range of feasible operation is at much larger temperature gradients and at temperatures of between around 200°C and 600°C.  This points to a wide range of industrial waste-heat, geothermal, and commercial solar applications.  Converting exhaust heat into electricity, to replace the alternator in a vehicle, is one application being vigorously pursued by ENECO and an auto industry partner.

ENECO chips could replace the Stirling engine in Stirling Energy System's (SES) commercial solar arrays, producing electricity at approximately twice the efficiency but at half the cost.  (Ref.)  With their present set-up, SES is already competitive with conventional energy generation, so an alliance with ENECO would enable them to drop substantially lower than conventional energy prices.  Furthermore, the size would be much smaller, and the maintenance far less.

The typical method of converting sun energy to electricity is via a photovoltaic (PV) module.  They typically cost around $4 to $6.00 per Watt, whereas the ENECO modules are projected to cost between $1 and $4.00 per Watt.  Furthermore, the ENECO module is more efficient at converting sun energy to electricity.  In harnessing heat, it draws from a much wider spectrum of the electromagnetic spectrum emitted by the sun -- not just from the visible wavelengths.

Inversely, if electricity is applied to the die, a refrigeration effect is evoked, potentially going down as low as minus 200°C.  This, likewise, has a wide range of commercial applications, such as cooling computer systems.  ENECO envisions harnessing the heat produced in a laptop motherboard, for example, and then using that energy to cool the essential components.

"The science is done", says Brown.  "Now we just need to engineer this for production," which he anticipates could be ready within as little as half a year.  The company is also forging strategic partnerships with a number of heavy-hitter industrial companies, such as MagCorp in Utah, which see a lot of waste heat going unused.  By establishing partnerships with these companies, ENECO is able to get closer to its financial requirements for completing the engineering process.

ENECO is also under contract to go public in the London Exchange within the next 12-16 months, to further raise funds for its ongoing development and commercialization.  They chose London over New York for a number of strategically advantageous reasons, several of which are enumerated in a recent Wall Street Journal article addressing the shift from NY to London.

The company was established in 1991 by Hal Fox in connection with cold fusion research being performed by Pons and Fleishmann at the University of Utah.  ENECO was tasked with finding a way of efficiently harnessing low-level heat.  In order to be feasible, cold fusion needed a method of converting low-level heat into electricity.  Two of the earlier methods analyzed were quantum tunneling and piezo effects (quartz), which ENECO ruled this out as not being feasible.

This many years later, the number of investors still anxiously waiting for a return on their investment is substantial, adding that much more pressure on ENECO to get something into the marketplace.  Notwithstanding the long time it has taken, when given an option, most investors opt for stock options rather then cashing out.

Thermalelectric technology has been around for about 150 years, actually predating internal combustion engine technology.  While ENECO's variations draw from the thermionic and thermoelectric predecessor work, it has developed substantial intellectual property of its own.  Ten U.S. patents have been issues, and nearly that many have been issued in other jurisdictions.  There are 48 patents filed or pending, in all.  Brown said ENECO would gladly license this IP to interested parties.  "One company can't possibly do all that can be done with this technology," he said.  The waste heat from fossil fuel combustion alone represents a trillion-dollar market.

Charles T. Maxwell, Senior Energy Analyst from the Wall Street firm, Weeden & Co, told Brown: "The cheapest barrel of oil is the one not consumed".

Brown, a Ph.D. Plasma Physicist and successful businessman, joined the ENECO team five years ago, and holds himself very confidently in articulating both the technical and business aspects of the company.  The whiteboard in his office has the archetypal markings of a brilliant mind busy communicating the ENECO vision to the myriad of visitors that frequent the place from all over the world.

Allan visited Brown at the ENECO facility in Salt Lake City this past Wednesday, and observed a prototype demonstration in which a die of dimensions 1 mm x 1 mm x 0.5 mm was subjected to increasing heat, and produced increasing voltage and amperage proportionately.   When the temperature in the lower electrode reached 300°C, while the upper electrode was maintained at room temperature, the voltage was at around 0.5 V, and the current was 4.7 amps.

The "staff scientist" running the tests was Victor Sevastyanenko, Ph.D., a Professor of Plasma Physics, who also demonstrated the analysis software he created.  He has been with ENECO for five and a half years.

The test procedure entails taking a ½-inch diameter boule [rod] of the alloy, cutting it thinly, polishing its surface, then applying a the thin film barrier.  These are then sliced into 1 mm squared sizes called "dies".  The sample is then measured, washed with alcohol, and a coating of indium gallium solder is applied (for conductivity) to the top and bottom of the die, as well as to the surface of both electrodes where the die will be set.

As heat is applied to the base electrode (copper rod of about ½-inch diameter), the voltage begins to appear.  A load (flat copper sheet) is intermittently removed then added to complete the circuit, and the current is measured.

The temperature of the bottom electrode was determined by extrapolation via two probes separated on the copper rod electrode.  The thermal conductivity of copper is well-known, so by measuring the difference between the two positions in the rod, the temperature at the end of the electrode can be calculated.


click for enlargement

The high current production by the die requires the die to remain small and not be scaled larger.  Scaling will come in the form of modularity, joining as many dies together as is needed for a given application.

Also present with Allan this past Wednesday's visit were Tai Robinson (ref.), also of NEC; David W. Allan (ref.), Sterling's father, who is an atomic clock physicist whose professional career was spent at NIST in Boulder; and David Yurth (ref.), who is involved with a different solid state thermal-electric conversion technology.

Yurth thinks that ENECO faces some daunting engineering challenges in making arrays of these very small dies that will hold up under the rigors of industrial applications with higher heat and vibration.  Brown responded that the small size of the dies is an advantage inasmuch as the smaller mass means less force being applied due to the acceleration forces that the vibrations induce, per the equation F=ma.  He does acknowledge that ENECO faces some heavy engineering issues, especially considering the variable expansion coefficients of the various materials that will be used in the die and its casing.  Each material behaves differently at different temperatures, so keeping things together and properly fastened and electrically connected will not be an easy task.  Their object of a 10-year lifetime target, for industrial applications, adds to the challenge.

Another contention that Yurth put forward is that the ENECO paradigm is like taking a sledge hammer to the materials to liberate the electrons.  The technology Yurth is involved with, which he says will be announced in about three weeks, works with nature, using homogeneous crystals that send the electrons to their periphery when subjected to heat differential; and it is scalable.  The feasible, operational temperature of the technology Yurth is involved with ranges from 0°C to 140°C.  So the two technologies are more supplemental than competitive in terms of their ranges of applications.  Yurth offered to assist ENECO identify solutions to the challenges they face in engineering for production.

ENECO has been trying a wide range of alloys to try and find the optimal combination for both thermal-electric conversion efficiency as well as cost and environmental concerns.  "Cadmium Tin Arsenide works really well," said Brown, "but environmentally it has serious problems."  Cadmium is banned in Europe.  Presently they are focusing on an alloy of Lead, Tin, and Telluride, and are in process of optimizing it.

A fairly significant gradient in temperature is needed for efficient operation.  For example, if one electrode was room temperature (17°C), the other electrode would need to be 113°C to achieve a 10% efficiency (Carnot).

ENECO has five permanent employees, and works closely with the University of Utah and other facilities for outsourcing certain tasks in the development process.  An early and still active player on the ENECO team is Peter Hagelstein of MIT, who is world renowned for his ongoing work in the field of cold fusion.

# # #


REFERENCES:

  • NIST Report: Measurement of High Efficiency in Hg0.86Cd0.14Te Thermionic Converters; Ray Radebaugh, and Mike Lewis; Physical and Chemical Properties Division; National Institute of Standards and Technology; Boulder, Colorado 80305; Prepared for ENECO, University of Utah Research Park, 391-B Chipeta Way, Salt Lake City, Utah 84108; December 7, 2001. (18 pp.)

         "Introduction: In March 2001 NIST was asked by ENECO to investigate the proper measurement procedures for determining the efficiency of solid-state thermionic energy converters...."



         "Conclusions: We have shown that high efficiencies in the conversion of thermal to electrical power in MCT samples are possible, but that rapid heating is required to obtain the results before the samples deteriorate at high temperatures in vacuum.  The high efficiency of 38% of Carnot determined for one of the MCT samples with rapid heating is comparable to the high values found by ENECO previously with layered samples under steady state conditions when heated in an argon atmosphere.  We should emphasize that the high efficiencies we have found are dependent on the theoretical correction to the zero-current heat flow."
  • Energy Conversion Using Diode-Like Structures; Yan Kucherov, Peter Hagelstein; Thermoelectrics Handbook, chapter 13; Edited by D.M. Rowe, Ph.D., D.Sc.; CRC; 2006.

         "Introduction: A new type of device called  thermal diode is described.  It consists of a wafer of thermoelectric material and incorporates a carrier energy sorting potential barrier on the emitter side and an ohmic return current blocking barrier on the collector side.  This device can be used for heat to electricity conversion or for cooling."

  • Importance of barrier layers in thermal diodes for energy conversion; Yan Kucherov, Peter Hagelstein (MIT), Victor Sevastyanenko and Harold L. Brown, Sivaraman Guruswamy, Wayne Wingert; Journal of Applied Physics; Vol. 97, No. 9; 1 May 2005; pp. 094902 1-8.  (This paper reflects the present understanding of the technology by ENECO.)



         "Abstract: Very high thermal to electric conversion efficiencies have been reported previously with thermal diode structures in which a thin n-type emitter layer is formed on the hot side of a thick near-intrinsic thermoelectric semiconductor.  The figure of merit derived from direct measurements of electrical parameters and heat flow is increased by as much as a factor of eight.  The question of what physical mechanisms are involved has been of interest since the initial observations of the effect.  We have conjectured that the short-circuit current injection in these experiments is due to a second-order thermionic injection mechanism.  More recently, we proposed that the open-circuit voltage comes about due to the presence of a p-type blocking layer between the emitter and the near-intrinsic bulk region.  The experiments reported here show that a p-type blocking layer is required for the effect, and the dependence of conversion efficiency on the blocking layer concentration and width is studied.  The results are generally consistent with calculations done so far based on nonlocal generalized Onsager-type transport model."
  • Enhanced figure of merit in thermal to electrical energy conversion using diode structures; Peter L. Hagelstein, Y. Kucherov; Applied Physics Letters; Vol. 81, No. 3; 15 July 2002; pp. 559-561.

See also

 

Page composed by Sterling D. Allan Jan. 5, 2007
Last updated January 12, 2007


 

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